共 50 条
- [31] Tribological Properties of In-Situ MoB Reinforced Cu-Sn-Al Composites Mocaxue Xuebao/Tribology, 2022, 42 (06): : 1116 - 1126
- [35] Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders Journal of Electronic Materials, 2002, 31 : 879 - 886
- [37] MECHANICAL BEHAVIOR OF SN1AG0.5CU AND SN3AG0.5CU ALLOYS AT HIGH STRAIN RATES INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B, 2013, : 491 - 505
- [38] Impression Creep Behavior of Sn-3.5Ag-0.7Cu/Cu Brazed PRESSURE VESSEL TECHNOLOGY: PREPARING FOR THE FUTURE, 2015, 130 : 1137 - 1142
- [39] Compression Stress–Strain Behavior of Sn-Ag-Cu Solders Journal of Electronic Materials, 2010, 39 : 97 - 104
- [40] Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders Journal of Materials Science: Materials in Electronics, 2015, 26 : 5625 - 5634