Microstructure and hardness of copper powder consolidated by plasma pressure compaction

被引：0
|
作者：
T. S. Srivatsan
B. G. Ravi
A. S. Naruka
L. Riester
S. Yoo
T. S. Sudarshan
机构：
[1] The University of Akron,Department of Mechanical Engineering
[2] High Temperature Materials Laboratory,Mechanical Characterization and Analysis Group
[3] Oak Ridge National Laboratory,undefined
[4] Materials Modification Inc.,undefined
来源：
Journal of Materials Engineering and Performance | 2001年 / 10卷
关键词：
copper powders; hot isostatic pressing; plasma pressure compaction;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Bulk fine-grained copper samples were prepared by consolidating copper powders using the technique of plasma pressure compaction (P2C). The specimens were obtained by consolidating the powder particles under conditions of electrical pulse and no-electrical pulse and at two different temperatures. Results reveal that pulsing of the powders prior to consolidation led to higher microhardness values than the samples that were obtained by consolidating the powder particles under no-pulse. Both nanohardness and microhardness increased with an increase in the temperature of consolidation. Samples consolidated at the higher temperature revealed evidence of grain coarsening. The influence of processing variables on microstructure development and hardness is presented and discussed.
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页码：449 / 455
页数：6
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