Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint

被引：0
|
作者：
Zhongmin Lai
Dan Ye
机构：
[1] Jiangsu University of Science and Technology,Provincial Key Laboratory of Advanced Welding Technology
来源：
Journal of Electronic Materials | 2016年 / 45卷
关键词：
Sn-Bi; microstructure; solder joint; strength; fracture;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The effect of Cu on the microstructure and properties of Sn-10Bi solder alloy/joint were investigated. The results showed that the microstructure of Sn-10Bi-Cu solder alloy consisted of a Sn-rich phase, Bi-rich phase, and particles of Cu6Sn5 intermetallic compounds (IMCs). The pasty range of Sn-10Bi-xCu had an influence on the spreading property of Sn-10Bi-xCu. Cu improved the growth of the IMCs layer during the liquid reaction stage. Furthermore, the hardness of the solder alloy increased as the Cu concentration of increased. The strength of the solder joint was controlled by the solder alloy hardness and the interfacial IMCs layer thickness together. For the joints with low solder alloy hardness and a thin IMCs layer, the fracture was in the solder alloy. For the joints with high solder alloy hardness and a thick IMCs layer, the fracture was in the IMCs layer.
引用
收藏
页码：3702 / 3711
页数：9
相关论文
共 50 条
  • [31] Asymmetrical solder microstructure in Ni/Sn/Cu solder joint
    Wang, S. J.
    Liu, C. Y.
    SCRIPTA MATERIALIA, 2006, 55 (04) : 347 - 350
  • [32] Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
    Wenxing Dong
    Yaowu Shi
    Zhidong Xia
    Yongping Lei
    Fu Guo
    Journal of Electronic Materials, 2008, 37 : 982 - 991
  • [33] Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy
    Dong, Wenxing
    Shi, Yaowu
    Xia, Zhidong
    Lei, Yongping
    Guo, Fu
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (07) : 982 - 991
  • [34] Microstructure and strength of Sn-Bi coated Sn-3.5 mass% Ag solder alloy
    Lee, JS
    Bang, WS
    Jung, JP
    Oh, KW
    MATERIALS TRANSACTIONS, 2004, 45 (03) : 783 - 789
  • [35] Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
    Jian, Minghong
    Su, Sinan
    Hamasha, Sa'd
    Hamasha, Mohammad M.
    Alkhazali, Atif
    JOURNAL OF ELECTRONIC PACKAGING, 2021, 143 (01)
  • [36] Microstructure and Mechanical Properties of Al Alloy Joint Soldered with Ni Foam/In-48Sn Composite Solder
    Chen G.
    Liu K.
    Xu X.
    Wu Y.
    Xiao Y.
    Cailiao Daobao/Materials Reports, 2023, 37 (17):
  • [37] Interfacial microstructure and mechanical properties of In–Bi–Sn lead-free solder
    M. L. Huang
    Q. Zhou
    N. Zhao
    L. D. Chen
    Journal of Materials Science: Materials in Electronics, 2013, 24 : 2624 - 2629
  • [38] THE MICROSTRUCTURE AND PROPERTIES OF AS-CAST Sn-Zn-Bi SOLDER ALLOYS
    Mladenovic, Srba A.
    Markovic, Desimir D.
    Ivanic, Ljubica S.
    Ivanov, Svetlana Lj.
    Acimovic-Pavlovic, Zagorka S.
    HEMIJSKA INDUSTRIJA, 2012, 66 (04) : 595 - 600
  • [39] Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder
    Lv, Xiaochun
    Pan, Zhen
    Liu, Yang
    Zhang, Chenghao
    Wang, Zhiyuan
    Sun, Fenglian
    METALS, 2025, 15 (02)
  • [40] Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
    Yang, Fan
    Zhang, Liang
    Liu, Zhi-quan
    Zhong, Su Juan
    Ma, Jia
    Bao, Li
    MATERIALS, 2017, 10 (05)
12345