New Approach to Distinguish Copper Molten Marks Based on Quantitative Microstructure Analysis Using Electron Backscatter Diffraction

被引:0
|
作者
Jinyoung Park
Joo-Hee Kang
Eui Pyeong Lee
Young Ho Ko
Sun Bae Bang
机构
[1] Korea Electrical Safety Corporation Research Institute,Safety Research Department
[2] Korea Institute of Materials Science,Materials Analysis & Evaluation Department
[3] Jeonju University,Department of Fire Safety Engineering
[4] Jeonbuk National University,Department of Electrical Engineering
来源
Fire Technology | 2021年 / 57卷
关键词
Copper; Molten mark; Globule; Arc bead; Electron backscatter diffraction (EBSD); Microstructure;
D O I
暂无
中图分类号
学科分类号
摘要
Molten marks identified at a fire site can aid in determining the cause of a fire. Quantitative analysis of such molten marks has not yet been reported, despite several identification methods for molten marks being proposed based on optical micrographs. Herein, we propose a new methodology to establish the quantitative microstructure parameters of the molten marks using electron backscatter diffraction (EBSD). The globules were generated by heating the copper conductor to 1100°C in a non-energized state. Then, the arc beads were prepared by shorting the copper wire at 25°C and 900°C in an energized state. The globules did not show evident demarcation lines and indicated that the microstructure consisted of globular or dendritic grains; this demonstrated that their characteristics were distinctly different from those of arc beads. However, the primary arc beads (PABs) shorted at 25°C exhibited a strong (001) texture perpendicular to the demarcation line and comprised large fractions of columnar grains with a small grain aspect ratio (GAR). The microstructure of secondary arc beads (SABs) shorted at 900°C presented a mixture of elongated and equiaxed grains with a large GAR and no specific development of texture. The GAR and (001) fraction perpendicular to the demarcation line could be discriminant parameters of PABs and SABs. Consequently, EBSD methods can be newly applied for the classification of globules, PABs, and SABs based on the quantitative microstructure information and orientation distribution.
引用
收藏
页码:1667 / 1682
页数:15
相关论文
共 50 条
  • [1] New Approach to Distinguish Copper Molten Marks Based on Quantitative Microstructure Analysis Using Electron Backscatter Diffraction
    Park, Jinyoung
    Kang, Joo-Hee
    Lee, Eui Pyeong
    Ko, Young Ho
    Bang, Sun Bae
    [J]. FIRE TECHNOLOGY, 2021, 57 (04) : 1667 - 1682
  • [2] Quantitative analysis of compatible microstructure by electron backscatter diffraction
    Chapman, Michael
    De Graef, Marc
    James, Richard D.
    Chen, Xian
    [J]. PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2021, 379 (2201):
  • [3] Quantitative microstructure characterization of self-annealed copper films with electron backscatter diffraction
    Pantleon, Karen
    Gholinia, Ali
    Somers, Marcel A. J.
    [J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2008, 205 (02): : 275 - 281
  • [4] Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation
    Wang, C. P.
    Fan, J. K.
    Li, F. G.
    Liu, J. C.
    [J]. STRENGTH OF MATERIALS, 2018, 50 (01) : 92 - 97
  • [5] Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation
    C. P. Wang
    J. K. Fan
    F. G. Li
    J. C. Liu
    [J]. Strength of Materials, 2018, 50 : 92 - 97
  • [6] Quantitative Analysis of Martensite and Bainite Microstructures Using Electron Backscatter Diffraction
    Wang, Yongzhe
    Hua, Jiajie
    Kong, Mingguang
    Zeng, Yi
    Liu, Junliang
    Liu, Ziwei
    [J]. MICROSCOPY RESEARCH AND TECHNIQUE, 2016, 79 (09) : 814 - 819
  • [7] Potential Method to Distinguish Copper Molten Marks Using Boundary and Grain Characteristics
    Park, Jinyoung
    Kang, Joo-Hee
    Jang, Hyo-Sun
    Ko, Young Ho
    Bang, Sun Bae
    [J]. MATERIALS, 2022, 15 (13)
  • [8] Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film
    Kim, Su-Hyeon
    Kang, Joo-Hee
    Han, Seung Zeon
    [J]. MATERIALS TRANSACTIONS, 2010, 51 (04) : 659 - 663
  • [9] Electron backscatter diffraction (EBSD) microstructure evolution in HPT copper annealed at a low temperature
    Zhilyaev, Alexander P.
    Sergeev, Semyon N.
    Langdon, Terence G.
    [J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2014, 3 (04): : 338 - 343
  • [10] A Review of Strain Analysis Using Electron Backscatter Diffraction
    Wright, Stuart I.
    Nowell, Matthew M.
    Field, David P.
    [J]. MICROSCOPY AND MICROANALYSIS, 2011, 17 (03) : 316 - 329