Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

被引：15
|
作者：
Kim, Su-Hyeon [1 ]
Kang, Joo-Hee [1 ]
Han, Seung Zeon [1 ]
机构：
[1] Korea Inst Mat Sci, Chang Won 641831, Gyeongnam, South Korea
来源：
MATERIALS TRANSACTIONS | 2010年 / 51卷 / 04期
关键词：
electron backscatter diffraction; copper film; columnar grain structure; high-angle grain boundary; twin boundary; annealing; grain growth; annealing twinning; ABNORMAL GRAIN-GROWTH; TEXTURE EVOLUTION; IN-SITU; ANISOTROPY; KINETICS;
D O I：
10.2320/matertrans.MG200910
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general high-angle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning. [doi:10.2320/matertrans.MG200910]
引用
收藏
页码：659 / 663
页数：5
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