at]Hard-switching reliability studies of 1200 V vertical GaN PiN diodes

被引:0
|
作者
O. Slobodyan
T. Smith
J. Flicker
S. Sandoval
C. Matthews
M. van Heukelom
R. Kaplar
S. Atcitty
机构
[1] Sandia National Laboratories,
[2] University of Arkansas,undefined
来源
MRS Communications | 2018年 / 8卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
We report on reliability testing of vertical GaN (v-GaN) devices under continuous switching conditions of 500, 750, and 1000 V. Using a modified double-pulse test circuit, we evaluate 1200 V-rated v-GaN PiN diodes fabricated by Avogy. Forward current-voltage characteristics do not change over the stress period. Under the reverse bias, the devices exhibit an initial rise in leakage current, followed by a slower rate of increase with further stress. The leakage recovers after a day’s relaxation which suggests that trapping of carriers in deep states is responsible. Overall, we found the devices to be robust over the range of conditions tested.
引用
收藏
页码:1413 / 1417
页数:4
相关论文
共 50 条
  • [21] The Impact of Hot Electrons and Self-Heating During Hard-Switching in AlGaN/GaN HEMTs
    Yang, Feiyuan
    Dalcanale, Stefano
    Gajda, Mark
    Karboyan, Serge
    Uren, Michael J.
    Kuball, Martin
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (03) : 869 - 874
  • [22] GaN-based pin diodes for microwave switching IC applications
    Yang, J. G.
    Yang, K.
    ELECTRONICS LETTERS, 2012, 48 (11) : 650 - 652
  • [23] Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
    Pavlidis, Georges
    Dallas, James
    Choi, Sukwon
    Shen, Shyh-Chiang
    Graham, Samuel
    PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017, 2017,
  • [24] Effect of the Heat Dissipation System on Hard-Switching GaN-Based Power Converters for Energy Conversion
    Lumbreras, David
    Vilella, Manel
    Zaragoza, Jordi
    Berbel, Nestor
    Jorda, Josep
    Collado, Alfonso
    ENERGIES, 2021, 14 (19)
  • [25] Fast System to measure the dynamic on-resistance of on-wafer 600 V normally off GaN HEMTs in hard-switching application conditions
    Barbato, Alessandro
    Barbato, Marco
    Meneghini, Matteo
    Silvestri, Marco
    Detzel, Thomas
    Haeberlen, Oliver
    Spiazzi, Giorgio
    Meneghesso, Gaudenzio
    Zanoni, Enrico
    IET POWER ELECTRONICS, 2020, 13 (11) : 2390 - 2397
  • [26] Design and Optimization of Vertical GaN PiN Diodes With Fluorine-Implanted Termination
    Liu, Yuxin
    Yang, Shu
    Sheng, Kuang
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2020, 8 (01) : 241 - 250
  • [27] Imaging the Impact of Proton Irradiation on Edge Terminations in Vertical GaN PIN Diodes
    Collins, K. C.
    King, M. P.
    Dickerson, J. R.
    Vizkelethy, G.
    Armstrong, A. M.
    Fischer, A. J.
    Allerman, A. A.
    Kaplar, R. J.
    Aktas, O.
    Kizilyalli, I. C.
    Talin, A. A.
    Leonard, F.
    IEEE ELECTRON DEVICE LETTERS, 2017, 38 (07) : 945 - 948
  • [28] Vertical GaN-on-GaN PIN diodes fabricated on free-standing GaN wafer using an ammonothermal method
    Chen, Sung-Wen Huang
    Wang, Hao-Yu
    Hu, Cong
    Chen, Yong
    Wang, Hao
    Wang, Jiale
    He, Wei
    Sun, Xiaojuan
    Chiu, Hsien-Chin
    Kuo, Hao-Chung
    Wang, Weicong
    Xu, Ke
    Li, Dabing
    Liu, Xinke
    JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 804 : 435 - 440
  • [29] Investigation of the Reverse Leakage Behavior and Substrate Defects in Vertical GaN Schottky and PIN Diodes
    Wang, Yekan
    Liao, Michael E.
    Huynh, Kenny
    Olsen, William
    Gallagher, James C.
    Anderson, Travis J.
    Huang, Xianrong
    Wojcik, Michael J.
    Goorsky, Mark S.
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2022, 11 (06)
  • [30] Reliability studies of vertical GaN devices based on bulk GaN substrates
    Kizilyalli, Isik C.
    Bui-Quang, P.
    Disney, D.
    Bhatia, H.
    Aktas, Ozgur
    MICROELECTRONICS RELIABILITY, 2015, 55 (9-10) : 1654 - 1661