Foreign Conductive Adhesives, Testing Methods, Properties, and Application. Review

被引:0
|
作者
Besednov K.L. [1 ]
Petrova A.P. [1 ]
Lukina N.F. [1 ]
Isaev A.Y. [1 ]
机构
[1] All-Russian Research Institute of Aviation Materials, Moscow
关键词
bond strength; conductive adhesive; conductive filler; electrical conductivity; volume resistivity;
D O I
10.1134/S1995421222010051
中图分类号
学科分类号
摘要
Abstract: The results of the search and analysis of information in the field of modern foreign conductive adhesives (mainly silver-containing ones) are presented and their main properties, as declared by the developers, and information on their application are presented. To compare the level of characteristics of conductive adhesives, some of their values have been transferred by the authors into the same dimension, which differs from the dimension presented in the original source. © 2022, Pleiades Publishing, Ltd.
引用
收藏
页码:40 / 48
页数:8
相关论文
共 50 条
  • [21] Wind turbine testing methods and application of hybrid testing: A review
    Lalonde, Eric R.
    Dai, Kaoshan
    Lu, Wensheng
    Bitsuamlak, Girma
    WIND AND STRUCTURES, 2019, 29 (03) : 195 - 207
  • [22] Novel Isotropical Conductive Adhesives for Electronic Packaging Application
    Tao, Yu
    Xia, Yanping
    Wang, Hui
    Gong, Fanghong
    Wu, Haiping
    Tao, Guoliang
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (03): : 589 - 592
  • [23] Development of Welding Methods and Thin Fields of Application.
    Dorn, Lutz
    1600, (24):
  • [24] METHODS OF MANUFACTURE OF ALUMINUM POWDERS AND THEIR FIELDS OF APPLICATION.
    Gopienko, V.G.
    Kiselev, V.P.
    Zobnina, N.S.
    Soviet powder metallurgy and metal ceramics, 1984, 23 (12): : 926 - 930
  • [25] Polyolefin copolymers: Synthesis, properties, and application.
    Kaminsky, W
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 221 : U360 - U360
  • [26] New methods for particle generation, formulation and application.
    Haubrich, ST
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 229 : U1017 - U1017
  • [27] A review on epoxy-based electrically conductive adhesives
    Aradhana, Ruchi
    Mohanty, Smita
    Nayak, Sanjay Kumar
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2020, 99
  • [28] A review on epoxy-based electrically conductive adhesives
    Aradhana, Ruchi
    Mohanty, Smita
    Nayak, Sanjay Kumar
    International Journal of Adhesion and Adhesives, 2020, 99
  • [29] Effect of porous copper on the properties of electrically conductive adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (10) : 7771 - 7779
  • [30] Properties of Porous Copper Filled Electrically Conductive Adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 221 - +