Predicting Effective Thermal Conductivity of Sintered Silver by Microstructural-Simulation-Based Machine Learning

被引:0
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作者
Chengjie Du
Guisheng Zou
Bin Feng
Jinpeng Huo
Zhanwen A
Yu Xiao
Wengan Wang
Lei Liu
机构
[1] Tsinghua University,State Key Laboratory of Tribology, Department of Mechanical Engineering
[2] Qinghai University,School of Mechanical Engineering
来源
关键词
Sintered silver; power electronics packaging; effective thermal conductivity; finite element modeling; microstructural descriptors; machine learning;
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学科分类号
摘要
Effective thermal conductivity (ETC) is an important property of sintered Ag for its application as die-attach material. However, accurate and fast ETC evaluation is still challenging for the conventional approaches. In this study, microstructural-simulation-based machine learning was performed to predict the ETC of sintered Ag. The microstructure-based finite element (FE) model was established by converting each pixel of microstructural image into one element, which saves the computational time while maintaining excellent prediction accuracy (relative error of 4.3% with the measurement result). The FE-simulated ETC values were then applied as target values of the machine-learning database and four manually selected microstructural descriptors (porosity, shape factor, dominant heat-transfer path and major heat-transfer barrier), which quantitatively describe the pore features of sintered Ag, served as the inputs. The trained machine-learning model, i.e., support vector regression model (whose hyper-parameters were optimized by genetic algorithm), can achieve efficient and accurate ETC prediction (determination coefficient R2 of 0.974), which significantly outperforms the existing analytical (severe overestimation) and semi-empirical models (R2 of 0.880 and 0.947). This work demonstrates the superiority of machine learning method and pioneers a pathway for ETC prediction, which can also be further extended to investigate other effective properties of sintered Ag.
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页码:2347 / 2358
页数:11
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