Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization

被引：0
|
作者：
Hongjin Jiang
Kyoung-Sik Moon
Jiongxin Lu
C. P. Wong
机构：
[1] School of Materials Science and Engineering,School of Chemistry and Biochemistry
[2] Georgia Institute of Technology,undefined
来源：
Journal of Electronic Materials | 2005年 / 34卷
关键词：
Surfactants; nanoparticles; conductive adhesives;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Five different types of surfactants were employed for nanoparticle functionalization and the effects of the surfactants on electrical properties of nano silver (Ag)-filled conductive adhesives were investigated. The Ag nanoparticles pretreated with the surfactants were incorporated into isotropic conductive adhesives (ICA) formulations as conductive fillers. By using the surfactants (S3, S4, and S5), the reduced resistivity of the nano Ag-filled adhesives could be achieved with 2×10−4 Θ-cm. The morphology studies showed that the low resistivity resulted from the sintering of nanoparticles.
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页码：1432 / 1439
页数：7
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