Design Optimization of a Thermoelectric Cooling Module Using Finite Element Simulations

The thermoelectric industry is concerned about the size reduction, cooling performance and, ultimately, the production cost of thermoelectric modules. Optimization of the size and performance of a commercially available thermoelectric cooling module is considered using finite element simulations. Numerical simulations are performed on eight different three-dimensional geometries of a single thermocouple, and the results are further extended for a whole module as well. The maximum temperature rise at the hot and cold sides of a thermocouple is determined by altering its height and cross-sectional area. The influence of the soldering layer is analyzed numerically using temperature dependent and temperature independent thermoelectric properties of the solder material and the semiconductor pellets. Experiments are conducted to test the cooling performance of the thermoelectric module and the results are compared with the results obtained through simulations. Finally, cooling rate and maximum coefficient of performance (COPmax) are computed using convective and non-convective boundary conditions.