共 50 条
- [42] Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 551 - 556
- [43] Transient liquid phase bonding of alumina to alumina via Bismuth oxide interlayer ULTRAFINE GRAINED AND NANO-STRUCTURED MATERIALS IV, 2014, 829 : 136 - 140
- [47] Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 423 (1-2): : 269 - 281
- [49] TRANSIENT LIQUID PHASE DIFFUSION BONDING OF STAINLESS STEEL 304 METALLURGICAL & MATERIALS ENGINEERING-ASSOCIATION OF METALLURGICAL ENGINEERS OF SERBIA, 2012, 18 (03): : 177 - 186
- [50] Microstructural development during transient liquid phase bonding of structural intermetallic compounds ANALYSIS OF IN-SERVICE FAILURES AND ADVANCES IN MICROSTRUCTURAL CHARACTERIZATION, 1999, 26 : 425 - 430