Preparation and properties of a superhydrophobic surface on the printed circuit board (PCB)

被引:0
|
作者
Xinyi Li
Kangli Yang
Zhiqing Yuan
Shujuan Liu
Juan Du
Cancheng Li
Shoutong Meng
机构
[1] Hunan University of Technology,National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, School of Packaging and Materials Engineering
[2] Zhuzhou Central Hospital,Department of Teaching
来源
Applied Physics A | 2023年 / 129卷
关键词
Superhydrophobic surface; Printed circuit board; Coating; Water resistance; Water contact angle;
D O I
暂无
中图分类号
学科分类号
摘要
Printed circuit board (PCB) and electronic components are widely used in practical applications. However, PCB and electronic components are not waterproof. When exposed to water vapor or corrosive liquid, it is easy to make electronic equipment short circuit, thus reducing its service life in practical applications. To solve this problem, an effective and low-cost superhydrophobic coating was prepared on the PCB. First, the solution prepared by hydrophobic nano-silica (Nano-SiO2) and dimethyl silicone oil (DSO) was sprayed on the PCB surface. Then, the surface was further modified with stearic acid (SA), and thus, a superhydrophobic surface with a water contact angle (WCA) of 160.24° and water sliding angle (WSA) of 3.5° was obtained. In a series of tests such as being placed under water for 10 h, at constant temperature (70 °C) and humidity (100%RH) chamber for 10 h, and outdoors for 8 months, the superhydrophobic coating on the PCB surface showed excellent water resistance. In addition, the coating had excellent stability against acid and alkali liquids, drinks, inks, etc. The coating fully solved the shortcoming of low water resistance of PCB and electronic components, and showed great potential application.
引用
收藏
相关论文
共 50 条
  • [31] Characterization of a Segmented Printed Circuit Board (PCB)-Based Extrapolation Ionization Chamber
    Khan, A.
    Radtke, J.
    DeWerd, L.
    [J]. MEDICAL PHYSICS, 2022, 49 (06) : E306 - E307
  • [32] Comparative study of different natural fibre printed circuit board (PCB) composites
    Kumar, Varun
    Gupta, Manan
    [J]. MATERIALS TODAY-PROCEEDINGS, 2021, 44 : 2097 - 2101
  • [33] Printed Circuit Board (PCB) Metagratings for Perfect Anomalous Refraction: Theory and Experiment
    Rabinovich, Oshri
    Komarovsky, Yuri
    Dikarov, Denis
    Epstein, Arid
    [J]. PROCEEDINGS OF THE 2019 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS (ICEAA), 2019, : 1070 - 1070
  • [34] Analyzing printed circuit board assembly lines using a PCB assembly template
    Jadhav, PD
    Smith, JS
    [J]. Proceedings of the 2005 Winter Simulation Conference, Vols 1-4, 2005, : 1335 - 1342
  • [35] High power triboelectric nanogenerator based on printed circuit board (PCB) technology
    Changbao Han
    Chi Zhang
    Wei Tang
    Xiaohui Li
    Zhong Lin Wang
    [J]. Nano Research, 2015, 8 : 722 - 730
  • [36] Analytical Design of Printed Circuit Board (PCB) Metagratings for Perfect Anomalous Reflection
    Rabinovich, Oshri
    Epstein, Ariel
    [J]. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2018, 66 (08) : 4086 - 4095
  • [37] Design and Development of Printed Circuit Board (PCB) for Smart Calorie Counter System
    Sapiee, Nurfarhana Mohamad
    Leu, Joo Yee
    Tanra, Mastang
    Safii, Nik Shanita
    Seng, Tan Wai
    Hamzah, Sareena Hanim
    Mokhtar, Mohd Hadri Hafiz
    Arsad, Norhana
    [J]. 2022 9TH INTERNATIONAL CONFERENCE ON ELECTRICAL AND ELECTRONICS ENGINEERING (ICEEE 2022), 2022, : 90 - 94
  • [38] An innovative method of recycling metals in printed circuit board (PCB) using solutions from PCB production
    Tan, Quanyin
    Liu, Lili
    Yu, Miao
    Li, Jinhui
    [J]. JOURNAL OF HAZARDOUS MATERIALS, 2020, 390
  • [39] SURFACE INVESTIGATION OF COPPER IN THE PRINTED-CIRCUIT BOARD
    MANARA, A
    SIRTORI, V
    [J]. SURFACE AND INTERFACE ANALYSIS, 1990, 15 (08) : 457 - 462
  • [40] Temperature dependence of surface breakdown on printed circuit board
    Du, BX
    [J]. PROCEEDINGS: ELECTRICAL INSULATION CONFERENCE AND ELECTRICAL MANUFACTURING & COIL WINDING TECHNOLOGY CONFERENCE, 2003, : 167 - 170