Influence of Weak Magnetic Field on Electrodeposition and Properties of Copper Films

被引：0
|
作者：
S. V. Kovalyov
C. Debiemme-Chouvy
N. V. Koval’ova
机构：
[1] Department of Innovative Engineering,
[2] Ukrainian State University of Chemical Technology,undefined
[3] Laboratoire Interfaces et Systèmes Electrochimiques (UMR 8235),undefined
[4] Sorbonne Université,undefined
[5] CNRS,undefined
来源：
Surface Engineering and Applied Electrochemistry | 2021年 / 57卷
关键词：
electrodeposition; magnetic field; copper; film; morphology; physical-mechanical properties;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：308 / 314
页数：6
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