Fabrication of microcapsule particles by electrospray and their use as latent curing agent for epoxy resin

被引：0
|
作者：
Chung Thi Kim Nguyen
Hung Hai Nguyen
Jun Seo Park
Hang Thi Nhat Nguyen
Tuyet Thi Anh Duong
Yong Soo Kim
Chi Han Ho
Manh Dang Le
Hieu Trung Bui
机构：
[1] Thu Dau Mot University,Department of Chemical Engineering and Research Center of Chemical Technology
[2] Hankyong National University,TMS Laboratory
[3] TMS Co. Ltd.,VK
[4] Nguyen Tat Thanh University,Tech, Hi
[5] University of Ulsan,Tech Institute
[6] Nha Trang University,Department of Physics and Energy Harvest
来源：
Iranian Polymer Journal | 2023年 / 32卷
关键词：
Electrosprayed; Epoxy resins; Curing agent; Polymer curing; 2-Phenylimidazole;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1281 / 1289
页数：8
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