Effect of anisotropy of tin on thermomechanical behavior of solder joints

被引：0
|
作者：
K. N. Subramanian
J. G. Lee
机构：
[1] Michigan State University,Department of Chemical Engineering and Materials Science
来源：
Journal of Materials Science: Materials in Electronics | 2004年 / 15卷
关键词：
Fatigue; Anisotropy; Stress State; Thermal Expansion; Electronic Material;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Properties of body centered tetragonal tin are highly anisotropic. As a consequence large stresses can develop at the tin grain boundaries due to coefficient of thermal expansion mismatch during temperature excursions. A modeling approach to evaluate the 3D stress states that develop at grain boundaries during thermomechanical fatigue in tin-based solder is presented. Development of significant amounts of stresses in the plane of the grain boundary can cause grain-boundary sliding and surface-relief effects, while those normal to the grain boundary can cause grain-boundary decohesion and cracking.
引用
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页码：235 / 240
页数：5
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