The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

被引:0
|
作者
C. M. L. Wu
D. Q. Yu
C. M. T. Law
L. Wang
机构
[1] City University of Hong Kong,Department of Physics and Materials Science
[2] Dalian University of Technology,Department of Materials Engineering
来源
关键词
Sn-9Zn lead-free solder; Ce and La rare earth elements; tensile strength; 0.2% proof stress; elongation; solderability; rosin-based active flux;
D O I
暂无
中图分类号
学科分类号
摘要
The Sn-Zn alloys have been considered as lead-free solders. It is well known that their poor properties of wetting and oxidation resistance are the main problems to prevent them from becoming commercially viable solders. In this paper, trace rare earth (RE) elements of mainly Ce and La have been used as alloying elements into the Sn-9Zn alloy. The results indicated that with the RE addition the originally coarse β-Sn grains in the microstructure of the alloy were refined. The tensile strength significantly increased with only a slight decrease in ductility. The surface tension was decreased, resulting in great improvement in wetting properties with rosin-based active flux.
引用
收藏
页码:921 / 927
页数:6
相关论文
共 50 条
  • [31] Investigation on properties of Ga to Sn–9Zn lead-free solder
    Wenxue Chen
    Songbai Xue
    Hui Wang
    Jianxin Wang
    Zongjie Han
    Journal of Materials Science: Materials in Electronics, 2010, 21 : 496 - 502
  • [32] Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints
    Shohji, Ikuo
    Shimoyama, Satoshi
    Ishikawa, Hisao
    Kojima, Masao
    ADVANCES IN FRACTURE AND DAMAGE MECHANICS VII, 2008, 385-387 : 429 - +
  • [33] Solidification behavior of Sn-9Zn-xAg lead-free solder alloys
    Tsai, YL
    Hwang, WS
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 413 : 312 - 316
  • [34] Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder
    Yu-hua Hu
    Song-bai Xue
    Hui Wang
    Huan Ye
    Zheng-xiang Xiao
    Li-li Gao
    Journal of Materials Science: Materials in Electronics, 2011, 22 : 481 - 487
  • [35] Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
    Yen, Yee-wen
    Liou, Wei-kai
    JOURNAL OF MATERIALS RESEARCH, 2007, 22 (10) : 2663 - 2667
  • [36] Effect of Ag-content on structure, corrosion behaviour and mechanical properties of Sn-9Zn lead-free solder alloy
    Gouda, El Said
    Aziz, H. Abdel
    El Gendy, Y.
    Allah, F. Saad
    Hammam, M.
    EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2010, 52 (03):
  • [37] Thermal and mechanical properties of Sn-Zn-Bi lead-free solder alloys
    El-Daly, A. A.
    Swilem, Y.
    Makled, M. H.
    El-Shaarawy, M. G.
    Abdraboh, A. M.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 484 (1-2) : 134 - 142
  • [38] Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
    Yee-wen Yen
    Wei-kai Liou
    Journal of Materials Research, 2007, 22 : 2663 - 2667
  • [39] Development of Sn-Zn-Al lead-free solder alloys
    Kitajima, M
    Shono, T
    FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2005, 41 (02): : 225 - 235
  • [40] Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder
    Jun Tian
    Chunfu Hong
    Lihua Hong
    Xiaohui Yan
    Pinqiang Dai
    Journal of Electronic Materials, 2019, 48 : 2685 - 2690