The Effect of Organic Additives on the Kinetics of Zinc Electroplating

被引:0
|
作者
T. G. Sitnikova
A. S. Sitnikov
机构
[1] Moscow State Evening Metallurgical Institute,
来源
Protection of Metals | 2005年 / 41卷
关键词
Zinc; Inorganic Chemistry; Organic Additive; Cathodic Process; Zinc Electroplating;
D O I
暂无
中图分类号
学科分类号
摘要
The effect of different organic additives on the cathodic process in chloride-ammonium zinc-plating electrolytes is studied depending on the concentration of additives and pH of the medium.
引用
收藏
页码:607 / 609
页数:2
相关论文
共 50 条
  • [21] EFFECT OF ORGANIC ADDITIVES ON THE KINETICS OF GROWTH AND PROPERTIES OF KDP CRYSTALS
    BARSUKOVA, ML
    KUZNETSOV, VA
    OKHRIMENKO, TM
    NAUMOV, VS
    KACHALOV, OV
    KLIMOVA, AY
    KOLYBAEVA, MI
    SALO, VI
    KRISTALLOGRAFIYA, 1992, 37 (04): : 1003 - 1010
  • [22] Effect of organic additives on formation and growth behavior of micro-void in electroplating copper films
    Moriyama, M
    Konishi, S
    Tsukimoto, S
    Murakami, M
    MATERIALS TRANSACTIONS, 2004, 45 (11) : 3172 - 3176
  • [23] New metrology system of organic additives in copper electroplating baths
    Hong, KM
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2003, 43 (02) : 286 - 289
  • [24] Cost-effective determination of organic additives in electroplating solutions
    Petkovsek, M
    Pevec, B
    Zevnik, C
    Voncina, D
    Eurocon 2005: The International Conference on Computer as a Tool, Vol 1 and 2 , Proceedings, 2005, : 1151 - 1154
  • [25] Potentiodynamic approach for determination of organic additives concentration in electroplating solutions
    Petkovsek, Marko
    Pevec, Bostjan
    Zevnik, Ciril
    Voncina, Danijel
    2006 IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE PROCEEDINGS, VOLS 1-5, 2006, : 1274 - +
  • [26] Role of organic additives on zinc plating
    Kavitha, B.
    Santhosh, P.
    Renukadevi, M.
    Kalpana, A.
    Shakkthivel, P.
    Vasudevan, T.
    SURFACE & COATINGS TECHNOLOGY, 2006, 201 (06): : 3438 - 3442
  • [27] Effect of Additives on Copper Electroplating Profile for TSV Filling
    Zhu, Yunhui
    Bian, Yuan
    Sun, Xin
    Ma, Shenglin
    Cui, Qinghu
    Zhong, Xiao
    Chen, Jing
    Miao, Min
    Jin, Yufeng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 56 - 59
  • [28] Quantum Chemical Study of the Leveling Property of Organic Additives for Ni Electroplating
    Luo Ming-dao
    Department of Chmistry
    Wuhan University Journal of Natural Sciences, 2003, (02) : 447 - 450
  • [29] The synergistic effects of additives on improving the electroplating of zinc under high current densities
    Hsieh, Ju-Cheng
    Hu, Chi-Chang
    Lee, Tai-Chou
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (10) : D675 - D681
  • [30] Effect of additives on electrodeposition of zinc
    Kumar, AS
    Pandian, CSR
    Ayyapparaju, J
    Bapu, GNKR
    BULLETIN OF ELECTROCHEMISTRY, 2001, 17 (08): : 379 - 384