Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections

被引：0
|
作者：
Hyeonchul Lee
Minsu Jeong
Gahui Kim
Kirak Son
Jeongmin Seo
Taek-Soo Kim
Young-Bae Park
机构：
[1] STATS ChipPAC Korea LTD.,School of Materials Science and Engineering
[2] Amkor Technology Korea Inc.,Department of Mechanical Engineering
[3] Andong National University,undefined
[4] Korea Advanced Institute of Science and Technology (KAIST),undefined
[5] Samsung Display Co.,undefined
[6] Ltd,undefined
来源：
Electronic Materials Letters | 2020年 / 16卷
关键词：
Cu interconnections; Co interlayer; Double cantilever beam test; Interfacial adhesion energy; Post-annealing;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：311 / 320
页数：9
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