Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints

被引：0
|
作者：
R. S. Lai
K. L. Lin
B. Salam
机构：
[1] National Cheng-Kung University,Department of Materials Science and Engineering, Frontier Material and Micro/Nano Science and Technology Center
来源：
Journal of Electronic Materials | 2009年 / 38卷
关键词：
Intermetallic compound; lead-free solder; Sn-Zn alloy;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Cu5Zn8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.
引用
收藏
页码：88 / 92
页数：4
相关论文
共 50 条
  • [21] Effect of Cu5Zn8 and Sn/Ag3Sn/Ag Diffusion Barrier on Interface Reaction of Sn/Cu Soldering
    Yao J.
    Chen X.
    Li H.
    Ma H.
    Wang Y.
    Ma H.
    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2022, 58 (02): : 43 - 49
  • [22] Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints
    Kim, Young Min
    Kim, Young-Ho
    2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 236 - 238
  • [23] A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder
    Lin, KL
    Chen, KI
    Shi, PC
    JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (12) : 1490 - 1495
  • [24] A potential drop-in replacement for eutectic Sn-Pb solder—The Sn-Zn-Ag-Al-Ga solder
    Kwang-Lung Lin
    Kang-I Chen
    Po-Cheng Shi
    Journal of Electronic Materials, 2003, 32 : 1490 - 1495
  • [25] Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging
    Chi-Yang Yu
    Jenq-Gong Duh
    Journal of Materials Science, 2012, 47 : 6467 - 6474
  • [26] Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints
    Tsao, Lung-Chuan
    Lai, Pei-Chun
    CRYSTALS, 2024, 14 (10)
  • [27] Improved drop reliability of Sn-Ag-Cu solder joints by Zn addition to a Cu wetting layer
    Park, Jae-Yong
    Kim, Young Min
    Kim, Young-Ho
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (08) : 5852 - 5862
  • [28] Inhibition growth of intermetallic compounds at solder/Cu of by addition of Zn into Sn-3.5Ag
    Qi, Kai
    Wang, Fengjiang
    Lai, Zhongmin
    Hanjie Xuebao/Transactions of the China Welding Institution, 2011, 32 (10): : 57 - 60
  • [29] In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient
    Zhong, Y.
    Zhao, N.
    Dong, W.
    Wang, Y. P.
    Ma, H. T.
    MATERIALS CHEMISTRY AND PHYSICS, 2018, 216 : 130 - 135
  • [30] The bonding of Sn-Zn-Ag-Al-Ga lead-free solder balls on Cu/Ni-P/Au BGA substrate
    Lin, KL
    Chiu, YT
    55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, : 692 - 695
12345