Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints

被引：0
|
作者：
R. S. Lai
K. L. Lin
B. Salam
机构：
[1] National Cheng-Kung University,Department of Materials Science and Engineering, Frontier Material and Micro/Nano Science and Technology Center
来源：
Journal of Electronic Materials | 2009年 / 38卷
关键词：
Intermetallic compound; lead-free solder; Sn-Zn alloy;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Cu5Zn8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.
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页码：88 / 92
页数：4
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