共 38 条
- [22] A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 225 - 228
- [24] THERMODYNAMIC INVESTIGATION OF LIQUID BINARY-ALLOYS OF COPPER WITH GALLIUM, GERMANIUM AND TIN AND OF SYSTEM GERMANIUM-ZINC ZEITSCHRIFT FUR METALLKUNDE, 1972, 63 (03): : 119 - &
- [27] Computational Investigation of the Evolution of Intermetallic Compounds Affected by Microvoids During the Solid-State Aging Process in the Cu-Sn System Journal of Electronic Materials, 2013, 42 : 999 - 1009