Inkjet printed electronics using copper nanoparticle ink

被引:0
|
作者
Jin Sung Kang
Hak Sung Kim
Jongeun Ryu
H. Thomas Hahn
Seonhee Jang
Jae Woo Joung
机构
[1] University of California,Mechanical and Aerospace Engineering Department
[2] Hanyang University,Department of Mechanical Engineering
[3] Korea Institute of Science and Technology,undefined
[4] Samsung Electro-Mechanics,undefined
关键词
Critical Thickness; Copper Nanoparticles; Inkjet Printing; Friction Parameter; Rigid Substrate;
D O I
暂无
中图分类号
学科分类号
摘要
Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200 °C of low temperature in N2 gas condition. The printed electrodes were made with various widths and thickness. In order to control the thickness of the printed electrode, number of printing was varied. Resistivity of printed electrode was calculated from the cross-sectional area measured by a profilometer and resistance measured by a digital multimeter. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). From the study, it was found that 10 times printed electrode has the most stable grain structure and low resistivity of 36.7 nΩ m.
引用
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页码:1213 / 1220
页数:7
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