Whole-wafer fabrication process for three-terminal double stacked tunnel junctions

被引:0
|
作者
G.P. Pepe
G. Peluso
R. Scaldaferri
L. Parlato
C. Granata
E. Esposito
M. Russo
机构
[1] Dipartimento Scienze Fisiche,
[2] Università di Napoli “Federico II”,undefined
[3] P.le Tecchio 80,undefined
[4] 80125 Napoli,undefined
[5] Italy,undefined
[6] INFM,undefined
[7] UdR di Napoli,undefined
[8] Piazzale Tecchio 80,undefined
[9] 80125 Napoli,undefined
[10] Italy,undefined
[11] Dipartimento Ingegneria dell'Informazione,undefined
[12] Seconda Università di Napoli,undefined
[13] Via Roma 29,undefined
[14] 81031 Aversa (CE),undefined
[15] Italy,undefined
[16] Istituto di Cibernetica del CNR,undefined
[17] Via Toiano 6,undefined
[18] 80078 Arco Felice,undefined
[19] Napoli,undefined
[20] Italy,undefined
关键词
PACS. 74.50.+r Proximity effects, weak links, tunneling phenomena, and Josephson effects – 85.25.Am Superconducting device characterization, design, and modeling;
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摘要
A new fabrication process for three-terminal superconducting devices consisting of two Josephson junctions in a stacked configuration is reported. The process is based on the deposition of the whole Nb/AlxOy/Nb-Al/AlxOy/Nb multilayer on a Si crystalline wafer without any vacuum breaking. Lift-off techniques, anodization processes and a SiO film deposition have been adopted for patterning and insulating the two tunnel stacked junctions. Devices have been characterized in terms of current-voltage (I-V) curves and Josephson critical current vs. the externally applied magnetic field. They show high quality factors (Vm values up to 65 mV at 4.2 K), and good current uniformity.
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页码:421 / 425
页数:4
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