Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections

被引：0
|
作者：
Daisuke Miyazaki
Yuji Ohno
Kenji Matsushita
机构：
[1] Osaka City University,Deptartment of Physical Electronics and Informatics, Graduate School of Engineering
[2] Sumitomo Electric Industries,undefined
[3] Ltd.,undefined
来源：
Optical Review | 2008年 / 15卷
关键词：
free-space digital optics; optical interconnects; optomechanics; alignment;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
We propose alignment-free optical modules using a solder-bump-bonding technique for constructing free-space optical interconnection systems without a special alignment procedure. Bonding pads for mounting an optoelectronic device chip are fabricated by exposing a photosensitive resin film to light traveling through the optical system of the module so that the image positions of the bonding pads on both image planes of the optical interconnection system are aligned with each other. A device chip is mounted by solder-bump bonding and is set at a proper position by the surface tension of molten solder. The effectiveness of the technique is verified by constructing alignment-free optical modules.
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页码：19 / 25
页数：6
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