Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages

被引：0
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作者：
M. D. Cheng
S. Y. Chang
S. F. Yen
T. H. Chuang
机构：
[1] National Taiwan University,Institute of Materials Science and Engineering
来源：
Journal of Electronic Materials | 2004年 / 33卷
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页码：L18 / L18
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