Fabrication of planar and three-dimensional microcoils on flexible substrates

被引:0
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作者
M. Woytasik
J.-P. Grandchamp
E. Dufour-Gergam
E. Martincic
J.-P. Gilles
S. Megherbi
V. Lavalley
V. Mathet
机构
[1] Université Paris Sud,Institut d’Electronique Fondamentale, UMRCNRS 8622, bâtiment 220
[2] Domaine Universitaire,Laboratoire des Matériaux et du Génie Physique, ENSPG
来源
Microsystem Technologies | 2006年 / 12卷
关键词
Flexible Substrate; Magnetic Sensor; Conductor Line; Contact Printing; Large Frequency Range;
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摘要
Inductors are basic components of magnetic sensors. Generally, with those sensors, a weak magnetic variation has to be detected. As the sensitivity increases with the inductance value, our objectives are to design inductors with a maximum of turns while keeping millimetric sizes for the sensor. In this work, we present two microcoil fabrication processes compatible with rigid and flexible substrates. The first one is used for the realization of planar microcoils with one step of copper micromoulding. For example, a 40-turn microcoil of 1 mm external diameter and 5 μm copper width and spacing wires has been obtained. The second process allows the fabrication of three-dimensional microcoils (microsolenoids). It is based on two steps of copper micromoulding. In this process, a grey-tone photolithography step is implemented. Microsolenoids with 10–13 wires have been realized.
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页码:973 / 978
页数:5
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