Featured issue: Lead-free solder and packaging

被引：0
|
作者：
Arthur Willoughby
机构：
来源：
Journal of Materials Science: Materials in Electronics | 2012年 / 23卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1 / 1
相关论文
共 50 条
  • [1] Featured issue: Lead-free solder and packaging
    Willoughby, Arthur
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (01) : 1 - 1
  • [2] The application of lead-free solder to optical fiber packaging
    Ou, SQ
    Xu, G
    Xu, YH
    Tu, KN
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (12) : 1440 - 1444
  • [3] The application of lead-free solder to optical fiber packaging
    Shengquan Ou
    Gu Xu
    Yuhuan Xu
    K. N. Tu
    [J]. Journal of Electronic Materials, 2004, 33 : 1440 - 1444
  • [4] Lead-free solder leads to `greener' IC packaging
    [J]. Electronic Design, 2000, 48 (05)
  • [5] Lead-free solder leads to "greener" IC packaging
    Morrison, D
    [J]. ELECTRONIC DESIGN, 2000, 48 (05) : 30 - 30
  • [6] SnZnAl lead-free solder with high packaging reliability
    Kitajima, M
    Shono, T
    Masuda, S
    [J]. 2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2003, 5288 : 762 - 767
  • [7] SPECIAL ISSUE: LEAD-FREE SOLDER MATERIALS PREFACE
    Zivkovic, Dragana
    [J]. JOURNAL OF MINING AND METALLURGY SECTION B-METALLURGY, 2007, 43 (02)
  • [8] Lead-free solder bumping by the electroplating process for electronic packaging
    Joseph, S
    Phatak, GJ
    Seth, T
    Gurunathan, K
    Amalnerkar, DP
    Kutty, TRN
    [J]. IEEE TENCON 2003: CONFERENCE ON CONVERGENT TECHNOLOGIES FOR THE ASIA-PACIFIC REGION, VOLS 1-4, 2003, : 1367 - 1371
  • [9] Research Progress of Nanoscale Lead-free Solder in Electronic Packaging
    Huang, Xi
    Zhang, Liang
    Wang, Xi
    Chen, Chen
    Lu, Xiao
    [J]. Cailiao Daobao/Materials Reports, 2024, 38 (23):
  • [10] Lead-free solder
    Black, H
    [J]. CHEMISTRY & INDUSTRY, 2005, (21) : 22 - 23
12345