Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

被引:1
|
作者
Wei-Hsun Chen
Pylin Sarobol
John R. Holaday
Carol A. Handwerker
John E. Blendell
机构
[1] Purdue University,School of Materials Engineering
[2] Sandia National Laboratories,Coatings and Surface Engineering
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
A strategy for identifying the preferred sites and overall propensity of a Sn film to form whiskers has been developed based on film textures, local grain orientations, and elastic strain energy densities (ESEDs), with preferred sites predicted to be grains with local high ESEDs. Using β-Sn films with various textures, ESED distributions were simulated for elastic and thermoelastic stresses depending on isothermal aging or thermal cycling conditions. Local high ESEDs are preferentially induced in (110) or (100) oriented grains with c-axes nearly parallel to the film plane; films with overall low ESEDs have strong (100) textures for elastic stresses and strong (001) textures for thermoelastic stresses, suggesting low propensities to form whiskers. This work establishes a model for understanding the effect of the β-Sn anisotropy on whisker formation and provides guidelines for testing whether engineering specific film textures will reduce a film’s propensity to form whiskers.
引用
收藏
页码:197 / 206
页数:9
相关论文
共 50 条
  • [31] Effects of Structures of Substrates on Sn Whisker Formation Using Substitutionally-Deposited Sn Films
    Okamoto, Naoki
    Fujii, Yuko
    Kurihara, Hiroaki
    Kondo, Kazuo
    MATERIALS TRANSACTIONS, 2009, 50 (10) : 2403 - 2409
  • [32] Chemical order and crystallographic texture of FePd:Cu thin alloy films
    Perzanowski, M., 1600, American Institute of Physics Inc. (111):
  • [33] Analysis of Pressure-Induced Whisker Nucleation and Growth in Thin Sn Films
    Jain, Nupur
    Wang, Xincheng
    Jagtap, Piyush
    Bower, Allan
    Chason, Eric
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (12) : 6639 - 6653
  • [34] EFFECT OF SPECULARITY AND THERMAL-EXPANSION IN THIN METALLIC-FILMS
    SHARMA, BK
    SRIVASTAVA, R
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1984, 3 (03) : 275 - 277
  • [35] Negative, anisotropic thermal expansion in monolithic thin films of crystalline metal-organic frameworks
    Wang, Zhengbang
    Weidler, Peter G.
    Azucena, Carlos
    Heinke, Lars
    Woell, Christof
    MICROPOROUS AND MESOPOROUS MATERIALS, 2016, 222 : 241 - 246
  • [36] Analysis of Pressure-Induced Whisker Nucleation and Growth in Thin Sn Films
    Nupur Jain
    Xincheng Wang
    Piyush Jagtap
    Allan Bower
    Eric Chason
    Journal of Electronic Materials, 2021, 50 : 6639 - 6653
  • [37] Observation of Highly Anisotropic Thermal Expansion of Polymer Films
    Chaikasetsin, Settasit
    Jung, Jun Young
    Kim, Hongdeok
    Kim, Brian S. Y.
    Seo, Jungju
    Choi, Joonmyung
    Bae, Kiho
    Park, Woosung
    ACS APPLIED MATERIALS & INTERFACES, 2023, 15 (22) : 27166 - 27172
  • [38] Shallow grain formation in Sn thin films
    Cai, Xiaorong
    Handwerker, Carol A.
    Blendell, John E.
    Koslowski, Marisol
    ACTA MATERIALIA, 2020, 192 : 1 - 10
  • [39] Anisotropic grain morphology, crystallographic texture and their implications for flux pinning mechanisms in MgB2 pellets, filaments and thin films
    Song, XY
    Babcock, SE
    Eom, CB
    Larbalestier, DC
    Regan, KA
    Cava, RJ
    Bud'Ko, SL
    Canfield, PC
    Finnemore, DK
    SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2002, 15 (04): : 511 - 518
  • [40] The microstructure and state of stress of sn thin films after post-plating annealing:: An explanation for the suppression of whisker formation?
    Sobiech, M.
    Welzel, U.
    Schuster, R.
    Mittemeijer, E. J.
    Huegel, W.
    Seekamp, A.
    Mueller, V
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 192 - +