Modeling of contact behavior between polishing pad and workpiece surface

被引:9
|
作者
Klocke F. [1 ]
Dambon O. [1 ]
Zunke R. [1 ]
机构
[1] Institute of Machine Tools and Production Engineering, Aachen University of Technology, Aachen
关键词
Polishing; Production process; Steel;
D O I
10.1007/s11740-007-0059-z
中图分类号
学科分类号
摘要
The polishing pad is one of the most significant components within a polishing system. It influences both the material removal rate and the surface finish. Furthermore, the wear behavior of the polishing pad is responsible for the shape accuracy. Nevertheless despite extensive research activity in recent years, there are still gaps of knowledge in terms of the working principle of a polishing pad. In this paper, the contact behavior of a polishing pad (polyurethane foam) with the workpiece surface is examined. For this, the polishing pad is modeled using a finite-element modeling (FEM) program and the deformation by pressing it against the rigid workpiece surface is investigated. Consequently, the local tensions are calculated, which are the basis for the penetration depth and therefore also for the material removal rate. © German Academic Society for Production Engineering (WGP) 2007.
引用
收藏
页码:9 / 14
页数:5
相关论文
共 50 条
  • [21] The influence of tool wear particles scattering in the contact zone on the workpiece surface microprofile formation in polishing quartz
    Filatov, Yu. D.
    Filatov, A. Yu.
    Syrota, O. O.
    Yashchuk, V. P.
    Monteil, G.
    Heisel, U.
    Storchak, M.
    JOURNAL OF SUPERHARD MATERIALS, 2010, 32 (06) : 415 - 422
  • [22] Experimental investigations into forces acting between cluster MR effect pad and workpiece surface
    Bai, Zhenwei
    Yan, Qiusheng
    Xu, Xipeng
    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2015, 51 (15): : 190 - 197
  • [23] Formation of a Deposit on Workpiece Surface in Polishing Nonmetallic Materials
    Filatov, Yu. D.
    Monteil, G.
    Sidorko, V. I.
    Filatov, O. Yu.
    SMART SENSORS, ACTUATORS, AND MEMS VI, 2013, 8763
  • [24] Contact model for a pad asperity and a wafer surface in the presence of abrasive particles for chemical mechanical polishing
    Bozkaya, Dincer
    Muftu, Sinan
    ADVANCES AND CHALLENGES IN CHEMICAL MECHANICAL PLANARIZATION, 2007, 991 : 343 - 348
  • [25] Research on the contact behavior between vessel shell and reinforcement pad
    Li, Lei
    Wu, Benhua
    Sang, Zhifu
    Jixie Qiandu/Journal of Mechanical Strength, 2007, 29 (06): : 975 - 981
  • [26] Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing
    Gao, Hong
    Su, Jianxiu
    DIGITAL DESIGN AND MANUFACTURING TECHNOLOGY, PTS 1 AND 2, 2010, 102-104 : 724 - +
  • [27] In situ monitoring and controlling surface shape of the polishing pad in continuous polishing
    Yin, Jin
    Jiao, Xiang
    Tang, Wenlong
    Zhu, Jianqiang
    OPTICAL ENGINEERING, 2018, 57 (07)
  • [28] Macromodel for changes in polishing pad surface condition caused by dressing and polishing
    Isobe, Akira
    Ogata, Kenjiro
    Kurokawa, Shuhei
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2014, 53 (01)
  • [29] Modeling of the road surface polishing based on contact-mechanics approach
    Kane, Malal
    Do, Minh Tan
    Piau, Jean-Michel
    Road Materials and Pavement Design, 2008, 9 (SPECIAL ISSUE) : 305 - 318
  • [30] Modeling of the Road Surface Polishing Based on Contact-mechanics Approach
    Kane, Malal
    Do, Minh Tan
    Piau, Jean-Michel
    ROAD MATERIALS AND PAVEMENT DESIGN, 2008, 9 : 305 - 318