Effects of solid-state annealing on the interfacial intermetallics between tin-lead solders and copper

被引：0
|
作者：
Kithva H. Prakash
Thirumany Sritharan
机构：
[1] Nanyang Technological University,School of Materials Engineering
来源：
Journal of Electronic Materials | 2003年 / 32卷
关键词：
Intermetallics; interface; solders; reliability; x-ray diffraction (XRD);
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The interfacial intermetallics between Cu and solder were studied for four Sn-Pb compositions at the annealing temperatures of 125°C, 150°C, and 175°C for up to 30 days. The η-phase (Cu6Sn5) layer formed during reflow continues to grow during annealing. An additional layer of ɛ-phase (Cu3Sn) forms at the η/Cu interface after an incubation annealing time. The thickness results fit a power-law relationship against time with average exponents 0.69 and 0.44 for the η phase and the ɛ phase, respectively. On prolonged annealing, the proportions of the individual phases in the total layer reach a steady state.
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页码：939 / 947
页数：8
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