Selective laser melting W–10 wt.% Cu composite powders

Tungsten–Copper (W–Cu) alloys are promising materials for electrical and thermal applications. However, its forming method still remains limited in conventional powder metallurgy technique which is not suitable for manufacturing parts with intricate shapes. In this work, selective laser melting technology was introduced for fabricating W–10 wt.% Cu alloys parts. The morphological feature of a single molten track was analyzed. The results show that liquid phase sintering with complete melting of the binder (Cu), but nonmelting of the structural metal (W), acts as the main mechanism in this process. The melting conditions of single layers in different processing parameters were investigated. The results show that a moderate melting zone can be acquired from an established process map. Moreover, investigations on multilayers forming show that the final density increases with the decrease of scan speed until it reaches a plateau due to the insufficient rearrangement in liquid phase sintering and the balling effect.