Grain boundary diffusion and segregation of Ni in Cu

被引：104

作者：

Divinski, Sergiy ^{[1
]}

Ribbe, Jens ^{[1
]}

Schmitz, Guido ^{[1
]}

Herzig, Christian ^{[1
]}

机构：

[1] Univ Munster, Inst Mat Phys, D-48149 Munster, Germany

来源：

ACTA MATERIALIA | 2007年 / 55卷 / 10期

关键词：

copper; grain boundary diffusion of nickel; grain boundary segregation of nickel;

D O I：

10.1016/j.actamat.2007.01.032

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Grain boundary (GB) diffusion of Ni-63 in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison's C and B kinetic regimes resulted in direct data of the GB diffusivity D-gb and of the so-called triple product P = s center dot delta center dot Dgb (s and delta are the segregation factor and the diffusional GB width, respectively). Arrhenius-type temperature dependencies for both the Dgb and P values were measured, resulting in the pre-exponential factors D-gb(0) = 6.93 x 10(-7) m(2) s(-1) and P-0 = 1. 89 x 10(-16) m(3) s(-1) and the activation enthalpies of 90.4 and 73.8 kJ mol(-1), respectively. Although Ni is completely soluble in Cu, it reveals a distinct but still moderate ability to segregate copper GBs with a segregation enthalpy of about 17 kJ mol(-1). (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：3337 / 3346

页数：10

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