Thermal performance of the multilayered honeycomb microchannel heat sink

被引：3

作者：

Liu, Yonglu ^{[1
]}

Luo, Xiaobing ^{[1
]}

Liu, Wei ^{[1
]}

Huang, Zhifeng ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China

来源：

ICEET: 2009 INTERNATIONAL CONFERENCE ON ENERGY AND ENVIRONMENT TECHNOLOGY, VOL 1, PROCEEDINGS | 2009年

关键词：

multilayer; honeycomb; microchannel; heat sink; SILICON MICROCHANNELS; METAL HONEYCOMBS; FRICTION; OPTIMIZATION; DEVICES; NETS; FLOW;

D O I：

10.1109/ICEET.2009.124

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

To develop a high effectiveness, reliable, cost-effective compact heat exchanger is one of the key issues for effective use of thermal energy. By stacking multilayered flat thin rectangular plates with a number of regular honeycomb cells etched inside, the well designed staggered fluid flow channels are formed to enhance heat transfer. For the cooling system with the new type design heat sink, experimental investigations were conducted under different flow rates and input heating powers. The heat power density of 15.7W/cm(2) can effectively removed with a substrate temperature rise of 61.9 degrees C under 2.4W pump power. The results show that the heat sink design provides a good choice for electronic products cooling applications.

引用

页码：487 / 490

页数：4

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