Packaging of Active Devices Using Plastic Injection Moulding

The concept of adaptronic systems proved to be a successful approach on laboratory scale worldwide, but up to now no large-scale, commercial applications were launched at the market. There is an essential need for series production methods, to preassemble the manifold of individual parts building an active compound device. Benefits are expected by reducing the expenditures for assembly, higher robustness against mechanical stress or environmental factors and thus prevention of damage during system production. This paper describes the process chain for manufacturing a complex compound device using plastic injection moulding as a series technology. Such compounds offer new application areas for example in automotive production or as power actuators for micro technology, handling and actuator systems.