Experimental and analytical study on the flow of encapsulant during underfill encapsulation of flip-chips

被引：17
|
作者：
Han, SJ [1 ]
Wang, KK [1 ]
Cho, SY [1 ]
机构：
[1] CORNELL UNIV,SIBLEY SCH MECH & AEROSP ENGN,CORNELL INJECT MOLDING PROGRAM,ITHACA,NY 14853
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.517409
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：327 / 334
页数：4
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