Using compact models in the early thermal design of electronics

被引：8

作者：

Eggink, HJ ^{[1
]}

Janssen, GM ^{[1
]}

Janssen, JHJ ^{[1
]}

机构：

[1] Philips Ctr Ind Technol, NL-5600 MD Eindhoven, Netherlands

来源：

NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM | 2003年

关键词：

compact model; boundary condition independent; printed circuit board; COMIC;

D O I：

10.1109/STHERM.2003.1194379

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The paper gives a description of how boundary condition independent (BCI) or compact models can be used in early estimates of component temperatures. For this purpose a spreadsheet program is made named COMIC, which functionality is described and demonstrated. The limitations of compact models and COMIC are addressed. The combination of COMIC and compact models makes use of classical metrics no longer necessary.

引用

页码：319 / 323

页数：5

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