共 50 条
- [1] Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives [J]. Journal of Materials Science: Materials in Electronics, 2016, 27 : 4516 - 4525
- [2] Influence of silica particles on the electrical and thermal properties of epoxy/silver based isotropic conductive adhesives [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2012, 243
- [4] Coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs) [J]. ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY, 2008, 580-582 : 213 - +
- [5] Investigation of Dynamic and Mechanical Thermal Behavior of Isotropic Conductive Adhesives [J]. PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 461 - 465
- [7] Stability of electrical resistance of isotropic conductive adhesives within mechanical stress [J]. 2006 INTERNATIONAL CONFERENCE ON APPLIED ELECTRONICS, 2006, : 35 - 38
- [9] Analytical equations for predicting the thermal properties of isotropic conductive adhesives [J]. Journal of Electronic Materials, 2005, 34 : 1586 - 1590