Terahertz Imaging for Nondestructive Inspection of Materials Including Conductive Microparticles

被引:0
|
作者
Kurabayashi, Toru [1 ]
Yodokawa, Shinichi [1 ]
Kosaka, Satoru [1 ]
机构
[1] Akita Univ, Grad Sch Engn & Resource Sci, Akita 0108502, Japan
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
THz imaging for nondestructive inspection of the materials including conductive microparticles has been studied by use of FDTD analysis and THz spectroscopy. The allocated conductive particles causes the scattering for THz-wave. Though the scattering factor depends on the frequency, a frequency selected wave would be suitable for nondestructive inspection.
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页数:2
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