Contact properties of Ni micro-springs for MEMS probe card

被引：0
|
作者：
Kataoka, K [1 ]
Itoh, T [1 ]
Suga, T [1 ]
Inoue, K [1 ]
机构：
[1] Univ Tokyo, Res Ctr Adv Scienceand Technol, Meguro Ku, Tokyo 1538904, Japan
来源：
ELECTRICAL CONTACTS-2004: PROCEEDINGS OF THE 50TH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS/THE 22ND INTERNATIONAL CONFERENCE ON ELECTRICAL CONTACTS | 2004年
关键词：
component; MEMS probe card; 3-dimensional fabrication; fritting;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We have developed MEMS probe cards consisting of micro-springs arranged in a 250-mum-pitch array. Three-dimensional spring structures were designed and Ni microsprings were directly fabricated on a circuit board by a multilayer electroplating process. IS shaped' springs consisting of seven electroplated layers and 'folded lever' springs of five layers were designed and fabricated. Mechanical properties of the micro-springs were measured and no fracture or deformation were found after applying force of 10 mN for 10,000 times to 7-layer springs, while deformation of 1 Am were found in 5-layer springs. Low force electric contacts of smaller than 5 Omega for Al, and 3 Omega for Cu electrodes were obtained. Difference of the contact resistance in different types of spring structure was found.
引用
收藏
页码：231 / 235
页数：5
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