Modeling of copper-carbon solid solutions

被引:14
|
作者
Ellis, DE [1 ]
Mundim, KC
Fuks, D
Dorfman, S
Berner, A
机构
[1] Northwestern Univ, Dept Phys & Astron, Evanston, IL 60208 USA
[2] Northwestern Univ, Mat Res Ctr, Evanston, IL 60208 USA
[3] Univ Bahja, Inst Phys, Salvador, BA, Brazil
[4] Technion Israel Inst Technol, Dept Phys, IL-32000 Haifa, Israel
[5] Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel
关键词
D O I
10.1016/S1369-8001(00)00019-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The atomistic simulations in the framework of the Generalized Simulated Annealing approach (GSA) and classical force fields lead to very reasonable relaxed geometries around the carbon interstitial in O-, T-, and TS-sites. We have thus shown that a highly efficient energy-sampling and relaxation scheme, implemented with tight constraints on a limited volume, provides a powerful steering mechanism for selection of geometries suitable for detailed investigation by first-principles methods. The results, based upon harmonic interactions between Cu atoms and a van der Waals interaction between Cu and C, predict the relaxed O-site to be more stable than the T-site by similar to 1.2 eV, in accordance with general expectations. The TS barrier to O-O diffusion is found to be similar to 0.8 eV, at a temperature of 0 K; the TS exhibits a strong local axial distortion of the pseudo-octahedral environment. The Density Functional results indicate a charge transfer of similar to 1 e to carbon, mostly from the first neighbor shell, in all relaxed environments studied. Bond-order data show the Cu-C interaction to be bonding in nature, despite the net 'repulsive interaction' leading to a surface state of lower net energy. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:123 / 127
页数:5
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