Regional effects and mechanisms of nanoparticle removal from Si substrate by laser plasma shock waves

被引：18
|
作者：
Gu, Qiongqiong [1 ]
Feng, Guoying [1 ]
Zhou, Guorui [2 ]
Han, Jinghua [1 ]
Luo, Ju [1 ]
Men, Jinliang [1 ]
Jiang, Yue [1 ]
机构：
[1] Sichuan Univ, Coll Elect & Informat Engn, Chengdu 610064, Sichuan, Peoples R China
[2] China Acad Engn Phys, Laser Fus Res Ctr, Mianyang 621900, Peoples R China
来源：
APPLIED SURFACE SCIENCE | 2018年 / 457卷
基金：
中国国家自然科学基金;
关键词：
Laser plasma shockwaves; Nanoparticle adhesion; Nanoparticle removal; Particle removal mechanisms; PARTICLE REMOVAL; CLEANING PROCESS; SILICON-WAFER; ALUMINUM; FRICTION; SURFACES; SIMULATION; BEHAVIOR;
D O I：
10.1016/j.apsusc.2018.06.234
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
We use laser-induced plasma shock waves to remove Al nanoparticles from a smooth silicon substrate. Our experimental results show that the removal mechanism varies for different substrate regions. We examine the factors influencing particle removal by evaluating the shock-wave spatial distribution and the removal mechanisms. Further, we evaluate the influence of the gap between the laser focus and substrate on the removal results. The effects of the laser focus and substrate particle sizes are also investigated, and the optimum removal conditions are obtained. Our study can aid in better understanding the mechanisms of particle removal from surfaces.
引用
收藏
页码：604 / 615
页数：12
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