Numerical solution of the problem of the limiting current for the copper electrodeposition from a solution of cupric sulfate and sulfuric acid in conditions of natural convection

被引：6
|
作者：
Volgin, VM [1 ]
Grigin, AP
Davydov, AD
机构：
[1] Tula State Univ, Tula, Russia
[2] Russian Acad Sci, Framkin Inst Electrochem, Moscow 119071, Russia
来源：
RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 2003年 / 39卷 / 04期
关键词：
Copper; Sulfate; Physical Chemistry; Convection; Boundary Layer;
D O I：
10.1023/A:1023392020203
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Equations for a boundary layer, written in self-similar variables, are integrated numerically to obtain distributions of concentration of ions Cu2+, H+, and SO42-; a hydrodynamic velocity; partial currents of electrolyte components; and the limiting current of copper deposition and determine the Rayleigh number for the system under consideration. The results are compared with an approximate analytical solution obtained earlier.
引用
收藏
页码：335 / 349
页数：15
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