HCI Temperature sense effect from 180nm to 28nm nodes

被引:1
|
作者
Federspiel, X. [1 ]
Camara, A. [1 ]
Michard, A. [1 ]
Diouf, C. [1 ]
Cacho, F. [1 ]
机构
[1] STMicroelectronics, Technol R&D, 850 Rue Jean Monnet, F-38926 Crolles, France
来源
2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2021年
关键词
CMOS reliability; hot carrier; temperature activation; self-heating;
D O I
10.1109/IRPS46558.2021.9405146
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A lot of efforts were made to take into account self-heating to improve aging models for hot carrier induced degradation. As a general approach, MOS transistor parameter drift measured at various stress voltages was renormalized to a common junction temperature using an apparent activation energy. We found that such an approach can induce significant errors since the temperature sense effect can represent up to 50% of the apparent measured Ea value. The error was attributed to temperature sense effect on measured drift, which was consistent with Vth and mobility models.
引用
收藏
页数:5
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