Ball-grid-array package thermal management

被引：0
|
作者：
Chung, K [1 ]
机构：
[1] AI Technol Inc, Lawrenceville, NJ 08648 USA
来源：
FOURTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM | 1998年
关键词：
D O I：
10.1109/STHERM.1998.660391
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
One of the main driving forces for the electronic market place has been the rapidly increasing power of central processing unit (CPU) and related component for personal computer (PC). The power being consumed by PC microprocessors have been steadily increasing from a few watts for X386 to more than 35 watts far "Pentium". They are scheduled to reach over 100 watts within the next few years. These powerful chips are typically packaged in Pin or Ball-Grid-Array packages either in flip-chip or traditional die-attach modes. The thermal management is extremely challenging for both inside and outside of the package. This paper will compare some of today solutions and interface materials in terms of performance, manufacturability and long-term reliability.
引用
收藏
页码：78 / 87
页数：10
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