Surface metallization with Ni-Cu bimetal for ZTA by electroless plating

被引:3
|
作者
He, Han [1 ,2 ]
Jiang, Yehua [1 ,2 ]
Ru, Juanjian [3 ]
Zhou, Rong [1 ,2 ]
Hua, Yixin [3 ]
机构
[1] Kunming Univ Sci & Technol, Sch Mat Sci & Engn, Kunming, Yunnan, Peoples R China
[2] Natl & Local Joint Engn Lab Adv Met Solidificat F, Kunming, Yunnan, Peoples R China
[3] Kunming Univ Sci & Technol, Fac Met & Energy Engn, Kunming, Yunnan, Peoples R China
基金
中国国家自然科学基金;
关键词
Surface metallization; ZTA particles; Ni– Cu bimetallic coatings; electroless plating; ionic liquid additive; DEEP EUTECTIC SOLVENTS; PARTICLES; NICKEL; IRON; CAST;
D O I
10.1080/09276440.2021.1913899
中图分类号
TB33 [复合材料];
学科分类号
摘要
The surface metallization of zirconia-toughened alumina (ZTA) particles with Ni-Cu bimetallic coatings is performed by electroless plating assisted with choline chloride-ethylene glycol (ChCl-EG) ionic liquid. The possible reactions and deposition sequences of the plating process have been analyzed based on the micro-morphologies of the Ni-Cu coated ZTA (ZTA@Ni-Cu) particles obtained at different reaction stages. The roles of ChCl-EG additive, reaction temperature, and ZTA concentration on the surface morphology, coating thickness, and element content of the ZTA@Ni-Cu particles are also investigated. Results show that uniform cauliflower-characteristic Ni-Cu coatings are formed on ZTA surfaces with 35 g center dot L-1 ChCl-EG at 65 degrees C. The coating thickness is about 26.9 mu m, and the element contents of Cu and Ni are 38.1 at% and 61.9 at%, respectively. Besides, a schematic illustration about the fabrication of ZTA@Ni-Cu particles is proposed to elaborate the formation process of Ni-Cu coatings and the function mechanism of ChCl-EG additive.
引用
收藏
页码:161 / 174
页数:14
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