Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process

被引:50
|
作者
Choi, CG [1 ]
Han, SP [1 ]
Kim, BC [1 ]
Ahn, SH [1 ]
Jeong, MY [1 ]
机构
[1] Elect & Telecommun Res Inst, Opt Interconnect Team, Taejon 305350, South Korea
关键词
hot-embossing process; large-core optical power splitters; planar lightwave circuit; polymer waveguide;
D O I
10.1109/LPT.2003.811139
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Large-core (42 x 43 mum) 1 x 16 optical power splitters in polymers have been fabricated. Y-branch waveguide structures with and without offsets in the are-bending regions were designed by the beam propagation method software and molded by a silicon-mold master using a hot-embossing process. The optical power splitters were produced by epoxy core filling and ultraviolet curing processes. The average insertion losses at a wavelength of 850 nm were measured to be 19.8 dB with offset and 17.1 dB without offset, respectively. The maximum uniformities were 3.3 dB with offset and 3.9 dB without offset, respectively.
引用
收藏
页码:825 / 827
页数:3
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