3-D Extension of Chemical Mechanical Polishing for Nano-Structuring Applications on Alternative Technologies

被引:0
|
作者
Ozdemir, Z. [1 ]
Basim, G. B. [1 ]
机构
[1] Ozyegin Univ, Dept Mech Engn, TR-34794 Istanbul, Turkey
来源
CHEMICAL MECHANICAL POLISHING 14 | 2016年 / 72卷 / 18期
关键词
D O I
10.1149/07218.0081ecst
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
In this study we tune the chemical mechanical polishing process to a 3-D level to generate controlled nanostructures on functional metallic surfaces such as titanium implants and steel based heating elements. The chemical passivation action of the CMP process on metallic surfaces enables the formation of inert interfaces resistant to corrosion and degradation while the induced nanostructures help tune the surface attachment/ detachment ability as these surfaces interact with alternative external elements.
引用
收藏
页码:81 / 84
页数:4
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