Electrical behavior of SiCp reinforced copper matrix composites by hot pressing

被引：1

作者：

Wang, Changchun ^{[1
]}

Min, Guanghui ^{[2
]}

Kang, Suk-bong ^{[3
]}

机构：

[1] Linyi Normal Univ, Dept Phys, Linyi 276005, Peoples R China

[2] Shandong Univ, Minist Educ, Sch Mat Sci & Engn, Key Lab Liquid Struct & Hered Mat, Jinan 250061, Peoples R China

[3] Korea Inst Mat Sci, Chang Won 641010, South Korea

来源：

MULTI-FUNCTIONAL MATERIALS AND STRUCTURES II, PTS 1 AND 2 | 2009年 / 79-82卷

关键词：

SiCp/Cu composite; electroless copper plating; electrical conductivity; MICROSTRUCTURE; CONDUCTIVITY;

D O I：

10.4028/www.scientific.net/AMR.79-82.1579

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.

引用

页码：1579 / +

页数：2

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