Lead-free borosilicate glass/fused quartz composites for LTCC applications

被引:8
|
作者
Yan, Tingnan [1 ]
Dong, Chao [1 ,2 ]
Zhao, Jianwei [1 ]
Khesro, Amir [3 ]
Liu, Zheng [4 ]
Sun, Shikuan [5 ]
Li, Junjie [1 ]
Sun, Rong [1 ]
Wang, Dawei [1 ]
机构
[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
[2] Guilin Univ Elect Technol, Sch Mat Sci & Engn, Guilin 541004, Peoples R China
[3] Abdul Wali Khan Univ, Dept Phys, Mardan 23200, Pakistan
[4] Anim Husb Res Inst Guangxi Zhuang Autonomous Reg, Nanning 530001, Peoples R China
[5] Foshan Univ, Sch Mat Sci & Energy Engn, Foshan 528000, Peoples R China
关键词
MICROWAVE DIELECTRIC-PROPERTIES; LOW CTE VALUE; GLASS-CERAMICS; DENSIFICATION;
D O I
10.1007/s10854-022-08420-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, novel lead-free composites based on AlF3-B2O3-SiO2 (ABS)/fused quartz (FQ) were synthesized for the low temperature-co-fired ceramic (LTCC) applications. The phase structure, sintering behavior, dielectric properties, and thermal expansion coefficient (TEC) of ABS/FQ composites have been investigated in detail. The crystallization of cristobalite phase was not observed within the whole range of compositions, leading to low TEC values. However, with the increase in FQ content, the densification was found to degrade. The optimized properties were observed for the composite with 65 wt% ABS glass and 35 wt% FQ (65ABS/FQ), sintered at 850 degrees C, which exhibited excellent relative density of 98.5%, dielectric constant of 4.61 (10 MHz), dielectric loss of 1.5 x 10(-3) (10 MHz), TEC value of 3.75 ppm/degrees C, and cofiring compatibility with Ag electrode, making 65ABS/FQ composites an interesting potential candidate for LTCC substrate material.
引用
收藏
页码:15033 / 15038
页数:6
相关论文
共 50 条
  • [41] Lead-free perovskites: growth, properties, and applications
    Yang, Fan
    Wang, Aocheng
    Yue, Shuai
    Du, Wenna
    Wang, Shaoli
    Zhang, Xiaotao
    Liu, Xinfeng
    SCIENCE CHINA-MATERIALS, 2021, 64 (12) : 2889 - 2914
  • [42] Lead-free piezoelectric BNKLT 1–3 composites
    K. H. Lam
    M. S. Guo
    D. M. Lin
    K. W. Kwok
    H. L. W. Chan
    Journal of Materials Science, 2008, 43 : 1677 - 1680
  • [43] Piezoelectric properties of polymer/lead-free ceramic composites
    Alexandre, M.
    Bessaguet, C.
    David, C.
    Dantras, E.
    Lacabanne, C.
    PHASE TRANSITIONS, 2016, 89 (7-8) : 708 - 716
  • [44] Hematite crystal growth in high-temperature lead-free multicomponent alkali borosilicate glass frit for red overglaze enamels
    Hashimoto, Hideki
    Kawabe, Dan
    Terasawa, Akane
    Inada, Hirofumi
    Takaishi, Taigo
    Okura, Toshinori
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2021, 41 (15) : 7886 - 7892
  • [45] Lead-free bismuth glass system towards eco-friendly radiation shielding applications
    Alzahrani, Jamila S.
    Sriwunkum, Chahkrit
    Tonguc, Baris Tamer
    Alothman, Miysoon A.
    Olarinoye, I. O.
    Al-Buriahi, M. S.
    RESULTS IN PHYSICS, 2023, 53
  • [46] Properties of borosilicate glass/Al2O3 composites with different Al2O3 concentrations for LTCC applications
    Xianfu Luo
    Huajie Tao
    Pengzhen Li
    Yao Fu
    Hongqing Zhou
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 14069 - 14077
  • [47] Properties of borosilicate glass/Al2O3composites with different Al2O3concentrations for LTCC applications
    Luo, Xianfu
    Tao, Huajie
    Li, Pengzhen
    Fu, Yao
    Zhou, Hongqing
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (17) : 14069 - 14077
  • [48] An Investigation of Lead-free Thick-film Resistors on LTCC Substrates - Preliminary Results
    Hrovat, Marko
    Kielbasinski, Konrad
    Makarovic, Kostja
    Belavic, Darko
    Lakubowska, Malgorzata
    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [49] Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications
    Arfaei, Babak
    JOM, 2014, 66 (11) : 2309 - 2310
  • [50] Effect of silica addition on microstructure, sintering behavior, and dielectric properties of borosilicate glass/alumina composites for LTCC application
    Yang Lu
    Yiting Shan
    Xiang Guo
    Yajuan Zhang
    Jingmin Feng
    Hongqing Zhou
    Journal of Materials Science: Materials in Electronics, 2023, 34