Tuning Negative Permittivity by Anodization of A 3D Copper Network

被引:3
|
作者
Hou, Qing [1 ]
Ju, Licheng [2 ]
Qin, Faxiang [2 ]
Peng, Huaxin [2 ]
Fan, Runhua [3 ]
机构
[1] Univ Shanghai Sci & Technol, Inst Photon Chips, Shanghai 200093, Peoples R China
[2] Zhejiang Univ, Sch Mat Sci & Engn, Inst Composites Sci Innovat InCSI, Hangzhou 310027, Peoples R China
[3] Shanghai Maritime Univ, Sch Ocean Sci & Engn, Shanghai 201306, Peoples R China
基金
上海市自然科学基金; 中国国家自然科学基金; 浙江省自然科学基金; 中国博士后科学基金;
关键词
FREQUENCY-SELECTIVE SURFACE;
D O I
10.1149/2162-8777/ac6697
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Negative permittivity is a required physical property of metamaterials which has been widely used in some emerging and unconventional applications, such as cloaking, perfect lens and perfect wave absorption. In addition to periodic meta-structured units, a composite with conductive networks, so-called metacomposite, is equivalent to diluted metals, which also exhibits negative permittivity properties at microwave frequency. The percolative metacomposites have the advantages of isotropic property, flexible preparation methods and low cost in achieving negative permittivity. However, building a percolation network from conductive fillers in an insulating matrix is a complicated process, and the dispersion of fillers is difficult to control. In this study, the percolation network was modulated on the basis of the conductive copper foam by anodization treatment. The conductivity and negative permittivity of the foam varied with the anodization time. As the anodization time increased, the foam changed from a typical Drude metal to a less conductive 3D structure with mitigated negative permittivity. The absolute value of the negative permittivity of Cu-30V-5h sample was two orders of magnitude lower than that of the samples anodised for 30V-3h, 20V-3h and 20V-1h. Therefore, anodization is a facile and effective method to control the conductivity and negative permittivity of copper epoxy metacomposites.
引用
收藏
页数:5
相关论文
共 50 条
  • [31] Effective permittivity of nanocomposites from 3D charge transport simulations
    Lean, Meng H.
    Chu, Wei-Ping L.
    JOURNAL OF APPLIED POLYMER SCIENCE, 2016, 133 (15)
  • [32] 3D BANDWIDTHS IN LIQUID COPPER AND COPPER-NICKEL
    WILLIAMS, GP
    NORRIS, C
    COMMUNICATIONS ON PHYSICS, 1976, 1 (07): : 199 - 202
  • [33] 3D reconstruction as a network service
    Ansoldi, S
    Buora, GB
    Roberto, V
    CAMP 2005: Seventh International Workshop on Computer Architecture for Machine Perception , Proceedings, 2005, : 294 - 299
  • [34] Electroplating Copper Filling for 3D Packaging
    Nagai, Mizuki
    Tamari, Yusuke
    Saito, Nobutoshi
    Kuriyama, Fumio
    Fukunaga, Akira
    Owatari, Akira
    Shimoyama, Masashi
    Moore, Catherine
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 648 - +
  • [35] 3D UAS Mapping of a Copper Mine
    Karas, Jakub
    GIM INTERNATIONAL-THE WORLDWIDE MAGAZINE FOR GEOMATICS, 2018, 32 (06): : 29 - 31
  • [36] 3D Printing of Highly Pure Copper
    Tran, Thang Q.
    Chinnappan, Amutha
    Lee, Jeremy Kong Yoong
    Nguyen Huu Loc
    Tran, Long T.
    Wang, Gengjie
    Kumar, Vishnu Vijay
    Jayathilaka, W. A. D. M.
    Ji, Dongxiao
    Doddamani, Mrityunjay
    Ramakrishna, Seeram
    METALS, 2019, 9 (07)
  • [37] Copper direct bonding for 3D integration
    Gueguen, Pierric
    Di Cioccio, Lea
    Rivoire, Maurice
    Scevola, Daniel
    Zussy, Marc
    Charvet, Anne Marie
    Bally, Laurent
    Lafond, Dominique
    Clavelier, Laurent
    PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, : 61 - +
  • [39] Meta-composites: NiO supported 3D carbon networks structured by 1D building blocks towards tailorable negative permittivity
    Yunpeng Qu
    Hanying Wang
    Guohua Fan
    Peitao Xie
    Yao Liu
    Journal of Materials Science: Materials in Electronics, 2018, 29 : 18815 - 18827
  • [40] Microscale 3D Printing of Nanotwinned Copper
    Behroozfar, Ali
    Daryadel, Soheil
    Morsali, S. Reza
    Moreno, Salvador
    Baniasadi, Mahmoud
    Bernal, Rodrigo A.
    Minary-Jolandan, Majid
    ADVANCED MATERIALS, 2018, 30 (04)